Specifications for this product appear below.
Characteristics
| Item | Specifications | Conditions | |
|---|---|---|---|
| Electrical characteristics | Rated current | 0.25A/contact (Max. 4 A at total contacts) | |
| Rated voltage | 60V AC/DC | ||
| Breakdown voltage |
150V AC for 1 min. | No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. | |
| Insulation resistance |
Min. 1,000Mohm (Initial) | Using 250V DC megger (applied for 1 min.) | |
| Contact resistance |
Max. 100mohm | Based on the contact resistance measurement method specified by JIS C 5402. | |
| Mechanical characteristics | Composite insertion force |
Max. 0.981N/contacts × contacts (initial) | |
| Composite removal force |
Min. 0.165N/contacts × contacts | ||
| Post holding force |
Min. 0.20N/contacts | Measuring the maximum force. As the contact is axially pull out. |
|
| Environmental characteristics | Ambient temperature |
–55°C to +85°C | No freezing at low temperatures. No dew condensation. |
| Soldering heat resistance | Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) | Infrared reflow soldering | |
| 300°C within 5 sec. 350°C within 3 sec. | Soldering iron | ||
| Storage temperature | –55°C to +85°C (product only) –40°C to +50°C (emboss packing) |
No freezing at low temperatures. No dew condensation. | |
| Thermal shock resistance (header and socket mated) |
5 cycles, insulation resistance min. 100Mohm, contact resistance max. 100mohm |
Sequence 1. –550-3°C, 30 minutes 2. ~, Max. 5 minutes 3. 85+30°C, 30 minutes 4. ~, Max. 5 minutes |
|
| Humidity resistance (header and socket mated) |
120 hours, insulation resistance min. 100Mohm, contact resistance max. 100mohm |
Bath temperature 40±2°C, humidity 90 to 95% R.H. |
|
| Saltwater spray resistance (header and socket mated) |
24 hours, insulation resistance min. 100Mohm, contact resistance max. 100mohm |
Bath temperature 35±2°C, saltwater concentration 5±1% |
|
| H2S resistance (header and socket mated) |
48 hours, contact resistance max. 100mohm |
Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. |
|
| Lifetime characteristics | Insertion and removal life |
30 times | Repeated insertion and removal speed of max. 200 times/ hours |
| Unit weight | 60 contact type: Socket: 0.03 g Header: 0.01 g | ||
Material and surface treatment
| Part name | Material | Surface treatment |
|---|---|---|
| Molded portion | LCP resin (UL94V-0) | - |
| Contact and Post | Copper alloy | Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) |
