Narrow Pitch (Board to FPC) Connectors: A35S Specifications

  • Sales
  • Support
  • Product Catalog
  • Downloads

Characteristics

ItemSpecificationsConditions
Electrical
characteristics
Rated current 0.25A/contact (Max. 4 A at total contacts)  
Rated voltage 60V AC/DC  
Breakdown
voltage
150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute.
Insulation
resistance
Min. 1,000Mohm (Initial) Using 250V DC megger (applied for 1 min.)
Contact
resistance
Max. 100mohm Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical
characteristics
Composite
insertion force
Max. 0.981N/contacts × contacts (initial)  
Composite
removal force
Min. 0.165N/contacts × contacts  
Post holding
force
Min. 0.20N/contacts Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient
temperature
–55°C to +85°C No freezing at low temperatures. No dew condensation.
Soldering heat resistance Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
Storage temperature –55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No freezing at low temperatures. No dew condensation.
Thermal shock
resistance
(header and
socket mated)
5 cycles,
insulation resistance min. 100Mohm,
contact resistance max. 100mohm
Sequence
1. –550-3°C, 30 minutes
2. ~, Max. 5 minutes
3. 85+30°C, 30 minutes
4. ~, Max. 5 minutes
Humidity
resistance
(header and
socket mated)
120 hours,
insulation resistance min. 100Mohm,
contact resistance max. 100mohm
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Saltwater spray
resistance
(header and
socket mated)
24 hours,
insulation resistance min. 100Mohm,
contact resistance max. 100mohm
Bath temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(header and
socket mated)
48 hours,
contact resistance max. 100mohm
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and
removal life
30 times Repeated insertion and removal speed of max. 200 times/ hours
Unit weight 60 contact type: Socket: 0.03 g Header: 0.01 g  

^ Back to top

Material and surface treatment

Part nameMaterialSurface treatment
Molded portion LCP resin (UL94V-0) -
Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)

^ Back to top



Partners Contact Corporate International Log In